Product Details
1. Application
The product is lead free solder bar, used in electronics parts and Electrical appliance.
2.The chemical composition
2.1 Main ingredient
Main ingredient(wt%) |
Cu |
Ni |
Sn |
0.7(±0.1)
|
0.05(±0.01)
|
Balance |
2.2 Impurity of solder alloy
Impurity of solder alloy(wt%) Max |
Pb |
Sb |
Bi |
P |
Fe |
Al |
Zn |
As |
In |
Cd |
0.03 |
0.05 |
0.1 |
0.003 |
0.02 |
0.001 |
0.001 |
0.03 |
0.05 |
0.002 |
3. Form, Diameter ,Weight and Tolerance
Form |
Dimension and Tolerance(mm) |
Weight |
Bar
|
Length 323.0 |
±5.0
|
715g/Pc (±5g)
|
Width 20.0 |
±2.5
|
Height 15.0 |
±1.5
|
4.Physical Property of solder alloy(Reference Value)
Melting Point |
Specific Gravity |
Tensile Strength |
Elongation |
Working Point |
227 ºC
|
7.4±0.2
|
34Mpa |
38% |
260-290ºC
|
5.Unit mass and Packaging
Packaging |
|
Type |
|
N.W/CTN |
G.W/CTN |
|
|
corrugated box
|
20KG±100g
|
20.3KG±100g
|